PCB Fabrication
Shenzhen Grande Electronic not only offers Printed Circuit Board fabrication, but also provides consistent high quality and affordable price of Printed Circuit Boards. We can fabricate Impedance Control PCB, Buried & Blind Holes PCB and Multilayer-layer PCBs. Our capabilities include:
- Multi-layer PCBs (1 to 40)
- Controlled Impedance PCB
- 100% Electrical Testing
- 3 mil Traces/3 mil Spaces
- FR4,Roger,Teflon and others
- Maximum Panel Size: 19.7" x 31.5"
- High Density Interconnect PCBs
- Blind, Buried and Plugged Vias
- Smallest Hole size: 0.006"
- Lead-Free compliant PCBs
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PCB Assembly
Shenzhen Grande Electronic offers turn-key PCB assembly services in prototype or low production volumes. We handle the whole process including: ordering all the components, PCB manufacturing, PCB assembly, testing and final shipment. We are capable of assembling BGA, Micro-BGA, QFN and other leadless package parts.
- SMT and Through-Hole Assembly
- Pb/Lead free Assembly
- One-stop PCB Assembly
- Prototype PCB Assembly
- PCB Assembly in low volumes
- Fine Pitch Component Insertion
- BGA and QFN Assembly
- BGA X-Ray Inspection
- Automated Optical Inspection
- PCB testing for functionality
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Parts Management
Shenzhen Grande Electronic has a well-established, effective component sourcing system for low cost electronic assembly. A dedicated team takes care of your PCB components procurement and parts management. We offer:
- Kitted PCB Assembly
- Sourcing Your Hard-To-Find Parts
- Unique Global IC Sources
- IC Programming
- Quick BOM Pricing in 24 hours
- Material Inventory Management
- Part Crosses and Substitutions
- Parts Incoming Check
- Electrical Characteristic Analysis
- Lowest Surcharge Rate
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IC Programming
Shenzhen Grande Electronic offers IC programming service in its state of the art electronics assembly facility. IC programming will be performed before the chips are mounted on the board. We support various package types including:
- DIP, SDIP
- TSSOP, PLCC
- BGA, CSP
- SOP, MSOP
- QFP, MLF
- QSOP, SSOP
- QFN, MLP
- SOT
- TSOP
- DFN
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Function Test
Shenzhen Grande Electronic offers Function Test(FCT) with its turn-key assembly services. Function Test usually is performed after the circuit boards are assembled and AOI & visual inspections are finished.
- Functional testers
- Design For Assembly
- AOI & visual inspections
- Avoid assembly issues
- Correct component failures
- Test software
- Functional Testing(FCT)
- The DFA report
- Embedded system testing
- Troubleshooting program
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Prototype Assembly 
